李寧成博士 1986年至今，任職于美國銦科技公司，現(xiàn)任該公司副總裁。在此之前，任職于Wright Patterson空軍基地材料實(shí)驗(yàn)室（1981-1982），Morton化學(xué)（1982-1984）和SCM（1984-1986）。他在SMT助焊劑和焊錫膏方面有20多年的研究經(jīng)驗(yàn)。此外，他在底部填充膠和粘接劑方面有著豐富的經(jīng)驗(yàn)�，F(xiàn)今，他的研究領(lǐng)域涉及到電子和光電子的互聯(lián)與封裝應(yīng)用的先進(jìn)材料，并且側(cè)重于高性能與低成本。
李寧成博士于1981年在美國阿克倫城大學(xué)獲得結(jié)構(gòu)-性質(zhì)關(guān)系聚合體科學(xué)博士學(xué)位。1976年，他在Rutgers 大學(xué)專修有機(jī)化學(xué)。1973年他在臺灣國立大學(xué)獲得化學(xué)學(xué)士學(xué)位。
李寧成博士最新出版了《再流焊工藝和缺陷偵斷：SMT，BGA，CSP和Flip Chip技術(shù)》。合著編寫了《無鉛，無鹵素和導(dǎo)電膠材料的電子制造》。同時(shí)，他還編寫了一系列關(guān)于無鉛焊接書籍的章節(jié)。他榮獲SMTA兩項(xiàng)大獎(jiǎng)和一項(xiàng)SMT雜志的最佳國際會議論文獎(jiǎng)。2002年榮獲SMTA杰出會員，2003年榮獲Soldertec的無鉛合作獎(jiǎng)。2006年榮獲CPMT特殊技術(shù)成就獎(jiǎng)。他就職于SMTA執(zhí)行董事會。此外，他還是《焊接與表面組裝技術(shù)》、《世界SMT與封裝》的編輯顧問，和IEEE電子封裝制造的副編輯。他有眾多的出版物以及經(jīng)常應(yīng)邀在全世界許多國際會議或者討論會上作學(xué)術(shù)報(bào)告，發(fā)表演講和簡短課程。
Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory (1981-1982), Morton Chemical (1982-1984), and SCM (1984-1986). He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
He received his PhD in polymer science on structure-property relationships from University of Akron in 1981. Prior to Akron period, he has studied organic chemistry at Rutgers University in 1976. He received a BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received two awards from SMTA and one from SMT Magazine for best proceedings papers of international conferences. He is honored as 2002 SMTA Member of Distinction, and received 2003 Lead-Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the board of director for SMTA. Among other editorial responsibilities, he serves as one of the editorial advisory boards of Soldering & Surface Mount Technology, Global SMT & Packaging, and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited seminars, keynote speeches, and short courses worldwide on those subjects at many international conferences or symposiums.
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